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  november 2006 rev 1 1/14 1 TDA7850 4 x 50w mosfet quad bridge power amplifier plus hsd features superior output power capability: 4 x 50w/4 max. 4 x 30w/4 @ 14.4v, 1khz, 10% 4 x 80w/2 max. 4 x 55w/2 @ 14.4v, 1khz, 10% mosfet output power stage excellent 2 driving capability hi-fi class distortion low output noise st-by function mute function automute at min. supply voltage detection low external component count: ? internally fixed gain (26db) ? no external compensation ? no bootstrap capacitors on board 0.35a high side driver protections: output short circuit to gnd, to v s , across the load very inductive loads overrating chip temperature with soft thermal limiter output dc offset detection load dump voltage fortuitous open gnd reversed battery esd description the TDA7850 is a breakthrough mosfet technology class ab au dio power amplifier in flexiwatt 25 package designed for high power car radio. the fully comp lementary p-channel/n- channel output structure allows a rail to rail output voltage swing, which, combined with high output current and minimised saturation losses, sets new power references in the car-radio field, with unparalleled distortion performances. the TDA7850 integrates a dc offset detector. order codes flexiwatt25 flexiwatt25 (vertical) (horizontal) part number package packing TDA7850 flexiwatt25 (vertical) tube TDA7850h flexiwatt25 (horizontal) tube www.st.com
contents TDA7850 2/14 contents 1 block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 application hints (ref . to the circuit of figure 3 ) . . . . . . . . . . . . . . . . . 10 3.1 svr . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.2 input stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.3 stand-by and muting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.4 dc offset detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.5 heatsink definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
TDA7850 list of tables 3/14 list of tables table 1. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 2. thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 3. electrical characteristcs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 4. revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
list of figures TDA7850 4/14 list of figures figure 1. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 2. pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 3. standard test and application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 4. p.c.b. and component layout of the figure 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 5. flexiwatt25 (vertical) mechanical data & package dimensions. . . . . . . . . . . . . . . . . . . . . . 11 figure 6. flexiwatt25 (horizontal) mechanical data & package dimensions . . . . . . . . . . . . . . . . . . . 12
TDA7850 block diagram and pin description 5/14 1 block diagram and pin description figure 1. block diagram figure 2. pin connection (top view) in1 0.1 f mute st-by in2 0.1 f out1+ out1- out2+ out2- pw-gnd in3 0.1 f in4 0.1 f out3+ out3- out4+ out4- pw-gnd pw-gnd pw-gnd d94au158d ac-gnd 0.47 f47 f svr tab s-gnd vcc1 vcc2 100nf 470 f hsd/v off_det hsd d94au159a tab p-gnd2 out2- st-by out2+ v cc out1- p-gnd1 out1+ svr in1 in2 s-gnd in4 in3 ac-gnd out3+ p-gnd3 out3- v cc out4+ mute out4- p-gnd4 hsd 1 25 d06au1655 tab p-gnd2 out2- st-by out2+ v cc out1- p-gnd1 out1+ svr in1 in2 s-gnd in4 in3 ac-gnd out3+ p-gnd3 out3- v cc out4+ mute out4- p-gnd4 hsd 1 25 vertical horizontal
electrical specifications TDA7850 6/14 2 electrical specifications table 1. absolute maximum ratings symbol parameter value unit v cc operating supply voltage 18 v v cc (dc) dc supply voltage 28 v v cc (pk) peak supply voltage (for t = 50ms) 50 v i o output peak current repetitive (duty cycle 10% at f = 10hz) non repetitive (t = 100 s) 9 10 a a p tot power dissipation tcase = 70c 80 w t j junction temperature 150 c t stg storage temperature -55 to 150 c table 2. thermal data symbol parameter value unit r th j-case thermal resistance juncti on to case max. 1 c/w table 3. electrical characteristcs (refer to the test and application diagram, v s = 13.2v; r l = 4 ; r g = 600 ; f = 1khz; t amb = 25c; unless otherwise specified). symbol parameter test condi tion min. typ. max. unit i q1 quiescent current r l = 100 180 280 ma v os output offset voltage play mode 60 mv dv os during mute on/off output offset voltage 60 mv during st-by on/off output offset voltage 60 mv g v voltage gain 25 26 27 db dg v channel gain unbalance 1 db p o output power v s = 13.2v; thd = 10% v s = 13.2v; thd = 1% v s = 14.4v; thd = 10% v s = 14.4v; thd = 1% 23 16 28 20 25 19 30 23 w w w w v s = 13.2v; thd = 10%, 2 v s = 13.2v; thd = 1%, 2 v s = 14.4v; thd = 10%, 2 v s = 14.4v; thd = 1%, 2 42 32 50 40 45 34 55 43 w w w w p o max. max. output power (1) v s = 14.4v; r l = 4 v s = 14.4v; r l = 2 50 80 w w
TDA7850 electrical specifications 7/14 thd distortion p o = 4w p o = 15w; r l = 2 0.006 0.015 0.05 0.07 % % e no output noise "a" weighted bw = 20hz to 20khz 35 50 50 70 v v svr supply voltage rejection f = 100hz; v r = 1vrms 50 70 db f ch high cut-off frequency p o = 0.5w 100 300 khz r i input impedance 80 100 120 k c t cross talk f = 1khz p o = 4w f = 10khz p o = 4w 60 70 60 - - db db i sb st-by current consumption v st-b y = 1.5v 20 a v st-b y = 0 10 a i pin5 st-by pin current v st-by = 1.5v to 3.5v 10 a v sb out st-by out threshold voltage (amp: on) 3.5 v v sb in st-by in threshold voltage (amp: off) 1.5 v a m mute attenuation p oref = 4w 80 90 db v m out mute out threshold voltage (amp: play) 3.5 v v m in mute in threshold voltage (amp: mute) 1.5 v v am in vs automute threshold (amp: mute) att 80db; p oref = 4w (amp: play) att < 0.1db; p o = 0.5w 6.5 7 7.5 8 v v i pin23 muting pin current v mute = 1.5v (sourced current) 7 12 18 a v mute = 3.5v -5 18 a hsd section v dropout dropout voltage i o = 0.35a; v s = 9 to 16v 0.25 0.6 v i prot current limits 400 800 ma offset detector (pin 25) v m_on mute voltage for dc offset detection enabled v stby = 5v 8v v m_off 6v v off detected differential output offset v stby = 5v; v mute = 8v 2 3 4 v v 25_t pin 25 voltage for detection = true v stby = 5v; v mute = 8v v off > 4v 01.5v v 25_f pin 25 voltage for detection = false v stby = 5v; v mute = 8v v off > 2v 12 v 1. saturated square wave output. table 3. electrical characteristcs (continued) (refer to the test and application diagram, v s = 13.2v; r l = 4 ; r g = 600 ; f = 1khz; t amb = 25c; unless otherwise specified). symbol parameter test condi tion min. typ. max. unit
electrical specifications TDA7850 8/14 figure 3. standard test and application circuit in1 0.1 f c9 1 f in2 c2 0.1 f out1 out2 in3 c3 0.1 f in4 c4 0.1 f out3 out4 d95au335b c5 0.47 f c6 47 f svr tab vcc1-2 vcc3-4 c8 0.1 f c7 2200 f c10 1 f st-by r1 10k r2 47k mute c1 14 15 12 11 22 4 13 s-gnd 16 10 25 1 hsd 620 9 8 7 5 2 3 17 18 19 21 24 23
TDA7850 electrical specifications 9/14 figure 4. p.c.b. and component layout of the figure 3. . components & bottom copper layer top copper layer
application hints (ref. to th e circuit of figure 3) TDA7850 10/14 3 application hints (ref. to the circuit of figure 3 ) 3.1 svr besides its contribution to the ripple rejection, the svr capacitor governs the turn on/off time sequence and, consequently, plays an essential role in the pop optimization during on/off transients. to conveniently serve both needs, its minimum recommended value is 10 f . 3.2 input stage the TDA7850's inputs are ground-compatible and can stand very high input signals ( 8vpk) without any performance degradation. if the standard value for the input capacitors (0.1 f) is adopted, the low frequency cut-off will amount to 16 hz. 3.3 stand-by and muting stand-by and muting facilities are both cmos compatible. in absence of true cmos ports or microprocessors, a direct connection to vs of these two pins is admissible but a 470 kohm equivalent resistance should be present between the power supply and the muting and stand-by pins. r-c cells have always to be used in order to smooth down the transitions for preventing any audible transient noises. about the stand-by, the time constant to be assigned in order to obtain a virtually pop-free transition has to be slower than 2.5v/ms. 3.4 dc offset detector the TDA7850 integrates a dc offset detector to avoid an anomalous dc offset on the inputs of the amplifier which may be multiplied by the gain, and result in a dangerous large offset on the outputs, which may lead to speaker damage through overheating. the feature is enabled by the mute pin and works with the amplifier unmuted and with no signal on the inputs. the dc offset detection is signaled out on the hsd pin. 3.5 heatsink definition under normal usage (4 ohm speakers) the heatsink's thermal requirements have to be deduced from fig. 18, which reports the simulated power dissipation when real music/speech programmes are played out. noise with gaussian-distributed amplitude was employed for this simulation. based on that, frequent clipping occurence (worst-case) will cause pdiss = 26w. assuming t amb = 70c and t chip = 150c as boundary conditions, the heatsink's thermal resistance should be approx imately 2c/w. this would avoid any thermal shutdown occurence even after long-term and full-volume operation.
TDA7850 package information 11/14 4 package information in order to meet environmental requirements, st offers these devices in ecopack ? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com. figure 5. flexiwatt25 (vertical) mechanical data & package dimensions outline and mechanical data dim. mm inch min. typ. max. min. typ. max. a 4.45 4.50 4.65 0.175 0.177 0.183 b 1.80 1.90 2.00 0.070 0.074 0.079 c 1.40 0.055 d 0.75 0.90 1.05 0.029 0.035 0.041 e 0.37 0.39 0.42 0.014 0.015 0.016 f (1) 0.57 0.022 g 0.80 1.00 1.20 0.031 0.040 0.047 g1 23.75 24.00 24.25 0.935 0.945 0.955 h (2) 28.90 29.23 29.30 1.139 1.150 1.153 h1 17.00 0.669 h2 12.80 0.503 h3 0.80 0.031 l (2) 22.07 22.47 22.87 0.869 0.884 0.904 l1 18.57 18.97 19.37 0.731 0.747 0.762 l2 (2) 15.50 15.70 15.90 0.610 0.618 0.626 l3 7.70 7.85 7.95 0.303 0.309 0.313 l4 5 0.197 l5 3.5 0.138 m 3.70 4.00 4.30 0.145 0.157 0.169 m1 3.60 4.00 4.40 0.142 0.157 0.173 n 2.20 0.086 o 2 0.079 r 1.70 0.067 r1 0.5 0.02 r2 0.3 0.12 r3 1.25 0.049 r4 0.50 0.019 v1 3? (typ.) v5? (tp.) v2 20? (typ.) v3 45? (typ.) (2): molding protusion included (1): dam-bar protusion not included flexiwatt25 (vertical) h3 r4 g v g1 l2 h1 h f m1 l flex25me v3 o l3 l4 h2 r3 n v2 r r2 r2 c b l1 m r1 l5 r1 r1 e d a pin 1 v v1 v1 7034862
package information TDA7850 12/14 figure 6. flexiwatt25 (horizontal) me chanical data & package dimensions outline and mechanical data dim. mm inch min. typ. max. min. typ. max. a 4.45 4.50 4.65 0.175 0.177 0.183 b 1.80 1.90 2.00 0.070 0.074 0.079 c 1.40 0.055 d 2.00 0.079 e 0.37 0.39 0.42 0.014 0.015 0.016 f (1) 0.57 0.022 g 0.75 1.00 1.25 0.029 0.040 0.049 g1 23.70 24.00 24.30 0.933 0.945 0.957 h (2) 28.90 29.23 29.30 1.139 1.150 1.153 h1 17.00 0.669 h2 12.80 0.503 h3 0.80 0.031 l (2) 21.64 22.04 22.44 0.852 0.868 0.883 l1 10.15 10.5 10.85 0.40 0.413 0.427 l2 (2) 15.50 15.70 15.90 0.610 0.618 0.626 l3 7.70 7.85 7.95 0.303 0.309 0.313 l4 5 0.197 l5 5.15 5.45 5.85 0.203 0.214 0.23 l6 1.80 1.95 2.10 0.070 0.077 0.083 m 2.75 3.00 3.50 0.108 0.118 0.138 m1 4.73 0.186 m2 5.61 0.220 n 2.20 0.086 p 3.20 3.50 3.80 0.126 0.138 0.15 r 1.70 0.067 r1 0.50 0.02 r2 0.30 0.12 r3 1.25 0.049 r4 0.50 0.02 v5? (typ.) v1 3? (typ.) v2 20? (typ.) v3 45? (typ.) flexiwatt25 (horizontal) 7399733 a (1): dam-bar protusion not included; (2): molding protusion included
TDA7850 revision history 13/14 5 revision history table 4. revision history date revision description of changes 22-nov-2006 1 first issue
TDA7850 14/14 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2006 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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